The SIMP is the all-new Solarius high-end process platform for the inspection of elements fabricated in semiconductor processes such as ICs, micro lenses or MEMS. The platform allows handling of all wafer sizes and types, including thin and Taiko wafers. The completely redeveloped SEMI compliant Win10 software platform allows a simple and intuitive operation in a contemporary look and feel.
The SIMP allows the integration of all optical sensor technologies available in the Solarius product portfolio as well as the combination of several sensors. The SIMP is available in modular concepts for 200/300 millimeter wafers as well as for up to 200 millimeter wafers to ensure optimal use of manufacturing space.
Both versions of the platform come with the new Win10 SEMI compliant user interface, which makes it easy to intuitively teach new products and provide error-proofing. In addition, an FDA-compliant audit trail is available as an option meeting international requirements and standards in the medical sector.
| Available Sensor Technolgies | confocal point, line & area sensors interferometric point & area sensors triangulation point & line sensors focus variation and fusion technologies |
| Standards applicable | SEMI, GAMP, FDA (optional) |
| SECS/GEM features | E4, E5, E30, E37, E39, E40, E87, E90, E94, E116, E84 AMHS |
| Hardware features | single / dual arm robots, ionizers class 1 FFU modules, AGV adapters edge grip, needle, Bernoulli end effectors air/N2 burst modules for warpage wafer |
| Media Supply | CDA, Vacuum, N2 (optional) 220V 16A 50Hz, single phase |
| Lateral Working Range | 400 mm x 400 mm |
| Vertical Working Range | 400 µm to 10 mm |
| Lateral Resoultion | 0.042 µm up |
| Vertical Resolution | 0.1 nm up |
