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In semiconductor industry, miniaturization has always led to more fast and dense packed integrated circuits showing increased performance and efficiency. Although the limits of physical feasibility are within a certain reach, development undoubtedly continues to this day. Especially in the backend of semiconductor manufacturing the interconnecting, packaging and testing is continuing its miniaturization with steadily increasing demands on quality. Besides semiconductor components manufacturing Nanotechnology opens up completely new applications for classical materials being processed through semiconductor processes. The innovative development of measurement technology at Solarius keeps pace with this miniaturization and provides right metrology at the right time, ensuring robust results in the characterization of micro- and nanosystems.

Semiconductor 3D Measuring Tasks


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Ball Grid Arrays

Due to their superior electrical properties, BGAs are widely being used to connect SMDs with circuit boards. For reliable contacting, it is necessary to monitor the bumps for size and coplanarity.

  • Contour and Shape
  • Volume
  • Particle Inspection
  • Bump Inspection
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Nanotechnologies

The trend towards reducing structure sizes in the semiconductor industry continues. Nanoscale materials reveal novel properties, but bring metrology devices to the limits of what is physically possible.

  • Step Height
  • Distance
  • Volume
  • Flatness
  • Nano Charactisation
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Wire Bonding

Wire bonding is a cost-effective way of contacting integrated circuits. Checking the wires and their connections with the contact pads is an essential part of quality assurance.

  • 3D Roughness
  • Step Height
  • Distance
  • Parallelism
  • Positioning
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Microstructuring

In the manufacture of microstructured circuits, adherence to the exact component geometries is a critical factor for component functionality.

  • Step Height
  • Distance
  • Contour and Shape
  • Volume
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Wafer Processing

Wafers must be inspected for shape and damage before and during their processing, as well as the chucks and susceptors, which ensure that the wafers are held securely.

  • Step Height
  • Defect Inspection
  • Flatness
  • Parallelism
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Die Bonding

Chip bonding is the application and contacting of an integrated circuit on a carrier. Exact placement and adherence to the epoxy resin quantity are prerequisites for perfect function and size.

  • Step Height
  • Distance
  • Flatness
  • Parallelism
  • Positioning
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