1 (844) 524-1023    
 

Viking

The Viking-C and Viking-T are portable, compact, and robust tabletop solutions for fast QC and off-line 3D measurements.  

Read more
Viking
 

SolarScan AOP

The SolarScan non-contact surface profilometer is a highly accurate and fast 3D laser measurement tool. 

Read more
SolarScan AOP
 

SolarSurf

The SolarSurf optical 3D confocal microscope is combined with a CCD camera to provide user-friendly 3D measurement solutions.

Read more
SolarSurf

SolarView

The SolarView measurement system is a combination of vision and laser technology to perform 3D and 2D surface measurements.

Read more
SolarView

Automated Solutions

Our affordable automated solutions are customer specific and developed based on application and process requirements.

Read more
 

IC Packaging: Process control for semiconductor back-end inspection

The task

Modern IC Packaging such as Chip Scale Package or Flip-Chip has advanced into new frontiers, with dimensions that continue to become smaller and smaller. This development presents new challenges for production, as warpage and coplanarity problems can occur. The Chip on Board Technology (COB) requires spot checks of fine pitch solder.


The solution

Our SolarScan enables manufacturers of IC Packaging modules to analyze warpage, lead coplanarity, laser marking and contact roughness.


Solder paste volume and position can be measured with the AutoScan platform


 

icpa-warpage
Measurement of spread, coplanarity and warpage (TSOP- Package)
icpa-solderbump
Automatic volume measurement of fine-pitch solder bumps with SolarScan
icpa-gluedots
Adhesive dots for microwave modules, measured with SolarScan.
 

 


Useful link:
BOIN's Semiconductor Linkpage
 
Joomla SEO by AceSEF

News and Events

Solarius Development announces introduction of linear motor stages standard on the SolarScan
- June, 2014
Solarius Development announces introduction of a new optical profiler
- October, 2013 SolarSurf Confocal Measuring Microscope
- April, 2014 New SolarMap 7.1 update

Solarius Development