IC Packaging: Process control for semiconductor back-end inspection
Modern IC Packaging such as Chip Scale Package or Flip-Chip has advanced into new frontiers, with dimensions that continue to become smaller and smaller. This development presents new challenges for production, as warpage and coplanarity problems can occur. The Chip on Board Technology (COB) requires spot checks of fine pitch solder.
Our SolarScan enables manufacturers of IC Packaging modules to analyze warpage, lead coplanarity, laser marking and contact roughness.
Solder paste volume and position can be measured with the AutoScan platform
Measurement of spread, coplanarity and warpage (TSOP- Package)
Adhesive dots for microwave modules, measured with SolarScan.
BOIN's Semiconductor Linkpage