IC Packaging: Process control for semiconductor
back-end inspection

The task
Modern IC Packaging such as Chip Scale Package or Flip-Chip advances into new frontiers, with dimensions that become smaller and smaller. This development presents new challenges for production, as warpage and coplanarity problems can occur. The Chip on Board Technology (COB) requires spot checks of fine pitch solder.

The solution
The LaserScan enables manufacturers of IC Packaging modules to analyze warpage, lead coplanarity, laser marking and contact roughness.
Solder paste volume and position can be measured with the AutoScan platform.

 

Measurement of spread, coplanarity and warpage (TSOP- Package)	Automatic volume measurement of fine-pitch solder bumps with LaserScan Click here to enlarge	Adhesive dots for microwave modules, measured with LaserScan
Useful link: BOIN's Semiconductor Linkpage